Carapace EMP 110 LPI Soldermask

Carapace^® EMP110 is a contact exposure, aqueous developing, liquid photoimageable soldermask, using the latest two-component epoxy technology to give high levels of chemical resistance and reliability. Carapace^® EMP110 has been used in the high volume production of PCBs since 1987. The Carapace^® family has been formulated to exceed the increasing demands of PCB processes, combined with a large process window.

• High resistance to ENIG surface finish chemistry
• Sub 50µm (2 mil) solder dam resolution
• Clean developing of small via-holes (0.1 to 0.2mm)
• Optimised rheological and coating properties for:
• Air-spray
• Electrostatic-spray
• Flat-bed screen-printing
• Double-sided vertical screen-printing
• Curtain-coating
• Excellent track-coverage up to 400µm copper heights
• Excellent adhesion to epoxy, polyimide and PTFE substrates
• Halogen-free
• Anti-solderball formulation tested and approved by major OEMs
• All versions are RoHS compliant, SM840 qualified and UL-94V-0 rated

Recent additions to the EMP110 range are versions suitable for Laser Direct Imaging (LDI). Available as a gloss, matt or extra-matt in green, blue, red, yellow, white, black, purple, grey, orange and transparent.

Datasheets

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